摘要
We introduce an analytical framework to understand the path for scaling nanophotonic interconnects to meet the energy and footprint requirements of CMOS global interconnects. We derive the device requirements for sub-100 fJ/cm/bit interconnects including tuning power, serialization-deserialization energy, and optical insertion losses. Using CMOS with integrated nanophotonics as an example platform, we derive the energy/bit, linear, and areal bandwidth density of optical interconnects. We also derive the targets for device performance which indicate the need for continued improvements in insertion losses (<8 dB), laser efficiency, operational speeds (>40 Gb/s), tuning power (<100 mu W/nm), serialization-deserialization (<10 fJ/bit/Operation), and necessity for spectrally selective devices with wavelength multiplexing (>6 channels).
- 出版日期2013-4