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摘要
Traditionally, condition monitoring of power semiconductor modules has been based on electrical measurements. Acoustic emission has been utilized for condition monitoring in many other applications, but is an unknown phenomenon in power semiconductor modules. In this paper, the authors present an experimental setup used to show that acoustic emission does occur because of the switching of power semiconductor components. An analysis based on propagation delays is used to determine the source of the acoustic emission.
- 出版日期2014-11
