摘要

In this paper; a novel effective numerical algorithm for-analysis of the bounces on the power/ground-plane structure in printed circuit board (PCB) or multichip modules (MCMs) is proposed, which is based upon planar circuit model combined with APA-E algorithm, Firstly, the planar circuit model is: developed to simulate; the power/ground bounces when switching current is added in the structure, Secondly, on the basis of the abstract Fade approximant and the extrapolation algorithm, the APA-E algorithm is proposed, The classical multivariable rational Pade approximant is also constructed for comparison; Comparing with finite difference time domain (FDTD) method, the new algorithm can provide a very accurate approximant in time domain, only requires little storage and CPU time. At last, attaching the decoupling capacitors for reducing the bounces on lossy power/ground-plane structures is also analyzed with this method.