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摘要
Abstract:A monocular vision three-dimensional detection method is proposed in this paper, in order to improve the accuracy and reliability of PCB solder joints in the quality inspection process. Firstly, the solder surface of the known height is calibrated with grayscale and the relevant parameters of the solder material is obtained by experiments. Then,by combining the deduced height calculation equation based on the illumination reflection model, and theobtained parameters by grayscale calibration, the height of initial point is calculated.Finally, the solder surface is recoveredbased on the height information of the solder joint surface which is obtained by superposition of the high calculation equation pixel by pixel. The experimental results show that the maximumdetection time of capacitance solder joint is less than 0.5 s, the maximumdetection time of integrated circuit solder joint is less than 1.5 s. Compared with the measurement with laser triangulation method, the maximum error is 0.119 mm which is less than 4% compared with the deviation of the actual height, the measurement accuracy is of 0.12 mm level in the actual height range from 0.436 mm to 1.601 mm sampling 10 sets of measured points at the same position.The results verify the effectiveness of the proposed method.
- 出版日期2018-5-1
- 单位华南理工大学
