A macroscopic mechanical model of the wire sawing process

作者：Liedke T^*; Kuna M

来源：International Journal of Machine Tools and Manufacture, 2011, 51(9): 711-720.

DOI：10.1016/j.ijmachtools.2011.05.005

• Wire saw
• Wire deflection
• Cutting forces
• Photovoltaic wafer

Based on experimental results, performed on an instrumented single wire saw, an analytical model for the macroscopic mechanical conditions in the wire sawing process is presented. The model describes the influence of important process parameters like wire velocity, feed velocity and tension force as well as geometric relations like ingot size and wire length to the lapping pressure and the shape of the formed wire bow. The model is based on macroscopic, measurable, machining parameters and uses the experimentally determined relation between pressure and removal rate according to Prestons law. The derived equations are used to study the influence of typical process parameters systematically and the results are exemplified for the production line of 6 in solar wafers.

• 出版日期2011-9
• 单位中国矿业大学（北京）