Spark Plasma Sintering constrained process parameters of sintered silver paste for connection in power electronic modules: Microstructure, mechanical and thermal properties

作者：Alayli N; Schoenstein F^*; Girard A; Tan K L; Dahoo P R

来源：Materials Chemistry and Physics, 2014, 148(1-2): 125-133.

DOI：10.1016/j.matchemphys.2014.07.021

• Powder metallurgy
• Nanostructures
• Sintering
• Mechanical properties
• Electrical conductivity
• Thermal conductivity

Processing parameters of Spark Plasma Sintering (SPS) technique were constrained to process nano sized silver particles bound in a paste for interconnection in power electronic devices. A novel strategy combining debinding step and consolidation processes (SPS) in order to elaborate nano-structured silver bulk material is investigated. Optimum parameters were sought for industrial power electronics packaging from the microstructural and morphological properties of the sintered material. The latter was studied by Scanning Electron Microscope (SEM) and X-Ray Diffraction (XRD) to determine the density and the grain size of crystallites. Two types of samples, termed S1 (bulk) and S2 (multilayer) were elaborated and characterized. They are homogeneous with a low degree of porosity and a good adhesion to the substrate and the process parameters are compatible with industrial constraints. As the experimental results show, the mean crystallite size is between 60 nm and 790 nm with a density between 50% and 92% resulting in mechanical and thermal properties that are better than that of lead free solder. The best SPS sintering parameters, the applied pressure, the temperature and the processing time were determined as being 3 MPa, 300 degrees C and 1 mm respectively when the desizing time of the preprocessing step was kept below 5 min at 150 degrees C. Using these processing parameters, acceptable for automotive packaging industry, a semi-conductor power chip was successfully connected to a metalized substrate by sintered silver with thermal and electrical properties better than those of current solders and with thermomechanical properties allowing absorption of thermoplastic stresses. 0 2014 Elsevier B.V.

• 出版日期2014-11-14