A cellular automaton-based simulator for silicon anisotropic etching processes considering high index planes

作者:Zhou Zai fa*; Huang Qing an; Li Wei hua; Deng Wei
来源:Journal of Micromechanics and Microengineering, 2007, 17(4): S38-S49.
DOI:10.1088/0960-1317/17/4/S03

摘要

This paper presents a novel 3D continuous cellular automaton (CA) model with high index planes such as (211), (311), (331) and (411) efficiently incorporated. A dynamic algorithm has also been developed to speed up the simulation process and reduce the memory usage. A 3D silicon anisotropic etching simulator, SEAES, has been implemented based on the 3D continuous CA model and the dynamic algorithm. The simulation results by SEAES have been found to be in good agreement with the experimental results, and the arbitrarily complex mask shapes and the merging of 3D etching profiles can be both efficiently and accurately handled. This is identified to be useful for the research of anisotropic etching technologies and the development of micro-electro-mechanical systems (MEMS) design.