Discharge Simulation and Fabrication Process of an Aluminum Electrode and an Alumina Layer in AC-PDP

作者：Liu Qifa; Ding Guifu; Yan Qun; Liu Chang; Wang Yan^*

来源：Plasma Science and Technology, 2013, 15(4): 368-375.

DOI：10.1088/1009-0630/15/4/11

• PDP
• addressing discharge
• formative delay
• manufacturing cost
• PIC-MCC

A larger space PDP cell with patterned aluminum as the addressing electrode and alumina as the dielectric layer was proposed. The aluminum electrode and the alumina dielectric layer formed on the aluminum electrode were prepared separately by magnetron sputtering and anodic oxidation for plasma display panel. The properties of the aluminum electrode and the alumina dielectric layer were tested and can meet the demand of PDP application. The resistivity of the aluminum electrode is about 5 x 10(-8) Omega.m, the voltage withstanding of the alumina dielectric layer exceeds 100 V/mu m and the relative permittivity is about 3.5 at 1 MHz. With this structure, the manufacturing cost of PDP could be cut and the addressing discharge formative delay is reduced by 0.67%, which is proved by PIC-MCC simulation.

• 出版日期2013-4
• 单位上海交通大学