摘要
In this work, we report the performance of 3 mu m gate length dual barrier InAlN/AlGaN/GaN HEMTs on Si substrates with gate-drain contact separations in the range 4-26 mu m. Devices with Pt- and Ni-based gates were studied and their leakage characteristics are compared. Maximum drain current I-DS of approximate to 1Amm(-1), maximum extrinsic transconductance g(m) approximate to 203mSmm(-1) and on-resistance R-on approximate to 4.07mm for gate to drain distance L-GD=4 mu m were achieved. Nearly ideal sub-threshold swing of approximate to 65.6mVdec(-1) was obtained for L-GD=14 mu m. The use of Pt-based gate metal stacks led to a two to three orders of magnitude gate leakage current decrease compared to Ni-based gates. The influence of InAlN layer thickness on the transistor transfer characteristics is also discussed.
- 出版日期2017-8