Discrete element simulation of micromechanical removal processes during wire sawing

作者：Liedke T; Kuna M^*

来源：Wear, 2013, 304(1-2): 77-82.

DOI：10.1016/j.wear.2013.04.026

• Wire sawing
• Wire lapping
• Discrete element method (DEM)
• Contact fracture mechanics
• Indenter

The material removal rate in the wire sawing technology depends on several features of the used abrasives and the complex process of particle movement and interaction inside the kerf. To investigate these micro-mechanical aspects of the wire sawing process, a numerical model is developed in the present paper. The model is based on the discrete element method adjusted to use sharp edged polygonal particles. The crucial procedure of material removal is implemented through concepts of the fracture mechanics of sharp edged indenters. The model allows to study the influence of essential parameters like wire speed, lapping pressure, particle shape, particle size distribution a.o. on the material removal process. A parametric study towards the influence of wire speed and lapping pressure on the amount of material removal is also presented. The parametric numerical studies carried out confirm the phenomenological law of Preston for the removal rate and enable correlations between the Preston coefficient and micro-mechanical process parameters.

• 出版日期2013-7-15