摘要
Capacitor structures with undoped and Al-doped TiO2 dielectrics grown on RuO2 electrodes by TiCl4-based atomic layer deposition were investigated. In the undoped films, relative permittivity values up to 160 were obtained. The leakage current densities were as low as 3 x 10(-8) and 3 x 10(-7) A cm(-2) in the TiO2 films with capacitance equivalent thicknesses (CETs) of 0.49 and 0.39 nm, respectively, at a voltage of 0.8 V. Al doping of TiO2 led to a decrease of leakage current as well as permittivity. As a consequence, comparable leakage current densities were obtained for undoped and Al-doped films at similar CET values.
- 出版日期2012-7
- 单位中国科学院电工研究所