A flexible method for the preparation of thin film samples for in situ TEM characterization combining shadow-FIB milling and electron beam-assisted etching

作者：Liebig J P^*; Goeken M; Richter G; Mackovic M; Przybilla T; Spiecker E; Pierron O N; Merle B

来源：Ultramicroscopy, 2016, 171: 82-88.

DOI：10.1016/j.ultramic.2016.09.004

• Thin films
• FIB
• Electron-beam-assisted etching
• XeF2
• Micromechanical testing

A new method for the preparation of freestanding thin film samples for mechanical testing in transmission electron microscopes is presented. It is based on a combination of focused ion beam.(FIB) milling and electron-beam-assisted etching with xenon difluoride (XeF2) precursor gas. The use of the FIB allows for the target preparation of microstructural defects and enables well-defined sample geometries which can be easily adapted in order to meet the requirements of various testing setups. In contrast to existing FIB-based preparation approaches, the area of interest is never exposed to ion beam irradiation which preserves a pristine microstructure. The method can be applied to a wide range of thin film material systems compatible with XeF2 etching. Its feasibility is demonstrated for gold and alloyed copper thin films and its practical application is discussed.

• 出版日期2016-12