Diffusion Bonding of TiC Cermet to Stainless Steel Using Impulse Pressuring with Ti-Nb Interlayer

作者：Li Jia; Sheng Guangmin^*

来源：Rare Metal Materials and Engineering, 2017, 46(4): 882-887.

DOI：10.1016/s1875-5372(17)30116-9

• TiC cermet
• diffusion bonding
• impulse pressuring
• Ti-Nb
• microstructure

Impulse pressuring diffusion bonding (IPDB) of TiC cermet to stainless steel 06Crl9Ni10 using Ti-Nb interlayer was carried out in an attempt to reduce the bonding time and to alleviate the detrimental effect of interfacial reaction products on bonding strength. Successful bonding is achieved at 890 degrees C under a pulsed pressure of 2 similar to 10 MPa within a duration of only 4 similar to 12 min, which is notably shortened in comparison with conventional diffusion bonding. Microstructure characterization reveals the existence of phase with a limit solubility of Nb, (beta-Ti, Nb) phase, and solid solution of Ni in alpha+beta-Ti in the reaction zone. Maximum shear strength of 110 MPa is obtained when the joint is bonded for 10 min, indicating a robust metallurgical bonding is achieved. Upon shear loading, the joints fracture along the remnant Ti/alpha-beta-Ti interface and extend to the interior of TiC cermet in a brittle cleavage manner. This technique provides a highly promising bonding method of TiC cermet and steel.

• 出版日期2017-4
• 单位重庆大学