Micro-compression test using non-tapered micro-pillar of electrodeposited Cu

作者：Mutoh Masahide; Nagoshi Takashi; Chang Tso Fu Mark; Sato Tatsuo; Sone Masato^*

来源：Microelectronic Engineering, 2013, 111: 118-121.

DOI：10.1016/j.mee.2013.02.040

• Micro-compression
• Copper
• Electrodeposition
• Size effect

We propose a novel method of mechanical test for measuring strength of electrodeposited Cu films using non-tapered micro-pillar. The grain size of each electrodeposited Cu films were changed by controlling current density and investigated by electron back scatter diffraction analysis. The pillars were fabricated by focused ion beam milling. The micro-compression test was carried out twice for each electrodeposition condition using a test machine designed for micro-sized specimen developed in our laboratory. The yield strength increased with increase of current density. The study showed that the influence of orientations on mechanical properties of the micro-sized specimens was magnified with reduction of the number of grains inside a sample.

• 出版日期2013-11