Active soldering of aluminum-graphite composite to aluminum using Sn3.5Ag4Ti0.5Cu active filler

作者：Tsao, Lung Chuan^*; Hsieh, Ming Jer; Chen, Ting Yu; Cheng, Shih Ying; Chen, Chih Wei

来源：International Journal of Materials Research, 2016, 107(9): 860-866.

DOI：10.3139/146.111407

• Al-graphite composite
• Sn3.5Ag4Ti0.5Cu active filler
• Active soldering

In this work, 6061-Al alloy-graphite (Al-Gr) composites were fabricated via the squeeze casting method. Al/Al-Gr joints were formed by direct active soldering with Sn3.5Ag4Ti0.5Cu active filler. The joint microstructures were examined using optical microscopy and scanning electron microscopy coupled with energy dispersive spectrometry. The Sn3.5Ag4Ti0.5Cu active filler can successfully join Al-Gr composite to 6061-Al alloy at a temperature of 250 degrees C. During direct active soldering, Al dissolves into the active filler zone to form a coarse Al-Ag-Sn solid solution around the active filler. The shear-tested bonding strengths were 14.30 /- 1.57 MPa for Al/Al, 8.45 /- 1.37 MPa for Al-Gr/Al, and 8.15 /- 1.43 MPa for Al-Gr/Al-Gr joints. In the Al/Al-Gr joints, the fractures occurred through the active filler/Al-Gr interface.

• 出版日期2016-9
• 单位中山大学