A reliability model for SAC solder covering isothermal mechanical cycling and thermal cycling conditions

作者：Herkommer Dominik; Punch Jeff^*; Reid Michael

来源：Microelectronics Reliability, 2010, 50(1): 116-126.

DOI：10.1016/j.microrel.2009.08.008

This paper presents an alternative to the use of energy-based methodologies for life cycle predictions of solder interconnects. Isothermal mechanical cycling testing has been conducted using joint-scale solder samples on a novel testing apparatus. The test data shows that work as a single parameter is insufficient in predicting failure; nor does the inclusion of cyclic frequency and mean temperature improve work-based methodologies. Here, a novel semi-empirical approach is presented in which stress, strain, strain rate and temperature are individually treated to create a model capable of predicting material behaviour under arbitrary cyclic loading conditions. The model constants are fitted to the results of the isothermal mechanical cycling tests, using load drop as a measure of damage. The calibrated model is then employed to predict the failure of a BGA device under thermal cycling. The modelling results show state-of-the-art agreement with the test data and superiority over Morrow model constants from literature that have been applied to this data set.

• 出版日期2010-1