摘要

In conventional X-ray imaging, the ray image of a complicated structural component (complex in shape or structure or composed of multiple materials) often appears to be overexposed or underexposed. This appearance is because of the variations in the effective thickness of the component along the orientation of the X-ray penetration exceed the limit of the dynamic range of the X-ray imaging system. Complete structural information cannot be obtained, and this lack will impact the quality of the X-ray image. To solve this problem, the technology of multi-voltage image stack reconstruction has been advanced. In this new method, the tube voltage is adjusted several times to accommodate the full necessary range of effective thickness, and then, the extracted images are fused to reconstruct the full projection information. The new technology can adequately enlarge the hardware potential to completely represent the internal structure information of a complicated structural component.