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摘要
A prestressed rectangular film clamped at both ends delaminates from a rigid punch. Based on a thermodynamic energy balance, the delamination mechanics is derived to relate the simultaneous external tensile force applied to the punch, punch displacement, and contact area. Effects of the coupled tensile residual membrane stress and adhesion energy at the punch-film interface are investigated. A "pinch off" (stable shrinking of the contact area to a line) is predicted, contrasting the nonzero "pull-off" radius in a clamped circular film. The model is useful in understanding the behavior of various adhesion-delamination phenomena, especially in one dimensional capacitive microelectromechanical systems radio frequency switches, microstructure network, and nanostructures.
- 出版日期2007-1-15
