Nanomilling mechanism on Cu surfaces investigated using atomistic simulation

作者：Wu Cheng Da; Fang Te Hua^*; Kuo Ching Hung

来源：Molecular Simulation, 2015, 41(14): 1159-1165.

DOI：10.1080/08927022.2014.952635

• rotation velocity
• scratching
• molecular dynamics
• nanomilling
• temperature

The nanoscale milling and scratching processes of copper workpieces are studied using molecular dynamics simulations based on the tight-binding and Morse potentials. The effects of the rotation velocity of the tool and the workpiece temperature are evaluated in terms of atomic trajectories, slip vectors, flow field of chips, cutting forces and groove characteristics. The simulation shows that a slip system in the ⟨110⟩ direction on the workpiece surface occurs for milling with a tool rotation velocity of omega=0 degrees/fs. However, no apparent slip system appears for omega=0.005 degrees/fs or higher; instead, the number of amorphous areas increases. At omega=0 degrees/fs (nanoscratching), most of the removed atoms pile up in front of the tool and some gradually backfill when the tool rotates due to the effects of rotational friction and adhesion between the tool and the removed atoms. The largest number of removed atoms that piled up in front of the tool were obtained for milling with omega=0 degrees/fs; the number of removed atoms that piled up in front of the tool decreased with the increasing omega value. The component forces corresponding to the feed direction of the tool are the largest for the nanodrilling and nanomilling processes. High-precision grooves can be obtained at a low workpiece temperature (e.g. room temperature) with omega=0 degrees/fs.

• 出版日期2015-9-22