A modified low-temperature wafer bonding method using spot pressing bonding technique and water glass adhesive layer

作者：Xu, Yang; Wang, Shengkai^*; Wang, Yinghui; Chen, Dapeng

来源：Japanese Journal of Applied Physics, 2018, 57(2): 02BD01.

DOI：10.7567/JJAP.57.02BD01

• SODIUM-SILICATE

A modified low-temperature wafer bonding method using a spot pressing bonding technique and a water glass adhesive layer is proposed. The electrical properties of the water glass layer has been studied by capacitance-voltage (C-V) and electric current-voltage (I-V) measurements. It is found that the adhesive layer can be regarded as a good insulator in terms of leakage current density. The bonding mechanism and the motion of bubbles during the thermal treatment are investigated. The dominant factor for the bubble motion in the modified bonding process is the gradient of pressure introduced by the spot pressing force. It is proved that the modified method achieves low-temperature adhesive bonding, minimizes the effect of water desorption, and provides good bonding performance.

• 出版日期2018-2
• 单位中国科学院大学