科研之友
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摘要
Multifunctional materials that are lightweight and thermally conductive but electrically insulating are important for modern electronics, computer, and telecommunication technologies. Here, a novel foam structure of a polymer/matrix composite filled with ceramic platelets with improved thermal conductivity is reported. Such improvement is caused by the stress-induced alignment of thermally conductive fillers in the cell wall of the plastic foam. The foam structure is very promising for use as a lightweight electronic packaging material owing to its light weight, thermal conduction ability, electrical insulation, and good processability.
- 出版日期2012-10
