科研之友
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摘要
Addressing the problems that occurred for electroforming of MEMS devices with high aspect ratio and geometry-complex structures, the electrochemical properties of a chloride bath are studied in this paper. It has been found that the tensile stress of nickel film from the chloride bath with the addition of saccharine is significantly reduced. Our results also suggested that, compared to the commonly used sulfamate bath, the chloride bath has higher throwing power and covering power, possibly due to its higher conductivity and polarizability. In addition, the presence of saccharine provided a finer grain nickel film with a smoother surface. Furthermore, the MEMS-based latching devices with narrow bars of 50 mu m width and 500 mu m thickness were obtained from the chloride bath, while the same devices with structure deficiency (incomplete structures) were frequently observed from the sulfamate bath. The finite element method simulations using the ANSYS software for the current density distribution on the surface of different aspect ratio latching structures were carried out. After considering the electrochemical perspectives from both baths, the mechanisms for the deficiency formation from the sulfamate bath and the absence of the deficiencies from the chloride bath were proposed and discussed.
- 出版日期2010-11
- 单位上海交通大学
