Measurement of Local Thermal Deformations in Heterogeneous Microstructures via SEM Imaging with Digital Image Correlation

作者：Guo S M; Sutton M A^*; Li N; Li X D; Wang L W; Rajan S

来源：Experimental Mechanics, 2017, 57(1): 41-56.

DOI：10.1007/s11340-016-0206-6

• Scanning electron microscopy
• 2D-DIC
• Nanoscale patterning
• Thermal deformation
• Heterogeneous material system
• Spatial and drift distortion correction
• Full-field strain measurements
• Sub-nanometer displacement resolution
• Sub-micron spatial resolution

It is challenging to measure accurately and with high spatial resolution the local thermal strains in heterogeneous microstructures due of the complex nature of the thermal deformations and local boundary conditions. In the enclosed study, a digital image correlation (DIC) based, thermal strain mapping technique is described that is able to probe thermal deformations with sub-micron spatial resolution and sub-nanometer displacement accuracy for both homogeneous and heterogeneous materials, including cross-sections of IC packages. The full-field thermal deformation maps of different materials within a nanostructured IC chip cross-section are established from room temperature up to 160 A degrees C, uncovering the heterogeneous nature of the specimen while accurately measuring the highly non-uniform displacement and strain fields across the multiple material constituents. As described in this work, the DIC-enabled technique is capable of high resolution mapping of local thermo-mechanical deformations in heterogeneous materials, providing a methodology that can improve our understanding of complex material systems under controlled thermal-environmental conditions.

• 出版日期2017-1