Anti-charging process for electron beam observation and lithography

作者:Aassime A*; Hamouda F; Richardt I; Bayle F; Pillard V; Lecoeur P; Aubert P; Bouchier D
来源:Microelectronic Engineering, 2013, 110: 320-323.
DOI:10.1016/j.mee.2013.02.036

摘要

Electron beam (e-beam) exposure of insulating material gives rise to charge accumulation which degrades pattern resolution and position during lithography and observation. In this paper we propose a process which reduces significantly the artifacts due to charging effects by using a charge dissipater based on a bi-layer deposited on top of the insulating substrate. The first layer is an inorganic thin film and soluble in water at room temperature, while the second layer is a metallic thin film. We reported the results of this process during e-beam lithography and observation of insulating samples.

  • 出版日期2013-10