An innovative method for joining materials at low temperature using silver (nano) particles derived from [AgO2C(CH2OCH2)(3)H]

作者：Oestreicher Annerose^*; Roehrich Tobias; Wilden Johannes; Lerch Martin; Jakob Alexander; Lang Heinrich

来源：Applied Surface Science, 2013, 265: 239-244.

DOI：10.1016/j.apsusc.2012.10.186

• Metal-organic silver complex
• Silver nanoparticles
• Pressureless sintering
• Low temperature
• Copper-to-copper silver joints

A novel method for the manufacture of compact sintered silver layers as joining materials at low temperatures without applying pressure is described. The metal-organic silver complex [AgO2C(CH2OCH2)(3)H] (3) is used, which generates silver nanoparticles with heat treatment below 200 degrees C. Complex (3) provides the features for the formation of a molten metal-like silver phase in which silver particles in the nanometer and submicron size range, respectively, are completely miscible. Within this study, copper specimens were bonded, and the joints were evaluated by cross-sectional scanning electron microscope (SEM) images. Moreover, this approach enables the incorporation of copper. An example is given with an average amount of 20 at.% copper content in the silver layer.

• 出版日期2013-1-15