A fusion prognostics-based qualification test methodology for microelectronic products

作者：Pecht Michael^*; Shibutani Tadahiro; Kang Myeongsu; Hodkiewicz Melinda; Cripps Edward

来源：Microelectronics Reliability, 2016, 63: 320-324.

DOI：10.1016/j.microrel.2016.04.002

• Microelectronics
• Physics-of-failure
• Prognostics
• Qualification testing
• Reliability

The global market for microelectronic products is projected to reach US$2.4 trillion per year by 2020. This growth has led to intense competition between manufacturers to minimize the time-to-market for their products. Unfortunately, however, qualification testing, which is time-consuming and resource-intensive, is a major bottleneck for the quick release of microelectronic products to the market. Hence, for both researchers and engineers considering the time with reliability issues during qualification testing, this paper provides a review of conventional methodologies in qualification testing and presents a fusion prognostics-based qualification test methodology that combines the advantages of physics-of-failure and data-driven methods.

• 出版日期2016-8