科研之友
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摘要
We report a copper electrodeposition with a microscopic structure of a regular ladder pattern on a silicon substrate where the ladder formation and evolution can be controlled by varying the electric field intensity during the electrodeposition. The deposit morphology varies from a periodic square-island structure to a ladder structure when the applied current is changed. The formation of a ladder structure with nanoparticles is related to the periodic potential measured across the electrodes. This method provides a deep insight into pattern formation in electrodeposition.
- 出版日期2008-2
- 单位吉林大学
