摘要

In this paper, high-frequency noise under different hot-carrier (HC) stress modes in nMOSFETs has been characterized and analyzed. The experimental results revealed a significant larger increase in NFmin and R-n under maximum substrate current I-B,I-max stress or hot hole injection H-inj than hot electron injection E-inj. It is suggested that the difference in high-frequency noise after stress strongly depends on the type of defects generated during HC stresses. Our results provide experimental verification that the shallow interface states/traps at the Si/SiO2 interface introduced by HC stress play an important role in the degradation of high-frequency channel noise.

  • 出版日期2012-11
  • 单位南阳理工学院