摘要

The autocatalytic electroless deposition (AED) of palladium onto p-silicon (100) with hydrogen termination was studied. Pd films were prepared by immersing the hydrogen-terminated silicon wafers into conventional HF-PdCl2-HCl solution at room temperature. The anodic stripping behaviors and morphologies of the Pd deposits were studied using cyclic voltammetry (CV), atomic force microscopy (AFM), and X-ray photoelectron spectroscopy (XPS). The results showed that the Pd growth was in Volmer-Weber (VW) mode and the Pd film had good adhesion.