Direct Copper Bonding for Power Interconnects: Design, Manufacturing, and Test

作者：Mouawad Bassem^*; Thollin Benoit; Buttay Cyril; Dupont Laurent; Bley Vincent; Fabregue Damien; Soueidan Maher; Schlegel Benoit; Pezard Julien; Crebier Jean Christophe

来源：IEEE Transactions on Components, Packaging and Manufacturing Technology, 2015, 5(1): 143-150.

DOI：10.1109/TCPMT.2014.2376882

• 3-D packaging
• power electronics
• semiconductor device packaging
• spark plasma sintering (SPS)

3-D power module structures allow for better cooling and lower parasitic inductances compared with the classical planar technology. In this paper, we present a 3-D technology that uses an innovative assembly method (direct copper-to-copper bonding). The concept and manufacturing process of this technology is described in detail. An accurate electrical characterization is then performed to compare its performance with that of the classical planar structures.

• 出版日期2015-1