Ambient plasma treatment of silicon wafers for surface passivation recovery

作者:Ge Jia*; Prinz Markus; Markert Thomas; Aberle Armin G; Mueller Thomas
来源:Japanese Journal of Applied Physics, 2017, 56(8): 08MB04.
DOI:10.7567/JJAP.56.08MB04

摘要

In this work, the effect of an ambient plasma treatment powered by compressed dry air on the passivation quality of silicon wafers coated with intrinsic amorphous silicon sub-oxide is investigated. While long-time storage deteriorates the effective lifetime of all samples, a short ambient plasma treatment improves their passivation qualities. By studying the influence of the plasma treatment parameters on the passivation layers, an optimized process condition was identified which even boosted the passivation quality beyond its original value obtained immediately after deposition. On the other hand, the absence of stringent requirement on gas precursors, vacuum condition and longtime processing makes the ambient plasma treatment an excellent candidate to replace conventional thermal annealing in industrial heterojunction solar cell production.

  • 出版日期2017-8