A 0.15-mm-Thick Noncontact Connector for MIPI Using a Vertical Directional Coupler

作者:Kosuge Atsutake*; Mizuhara Wataru; Shidei Tsunaaki; Takeya Tsutomu; Miura Noriyuki; Taguchi Masao; Ishikuro Hiroki; Kuroda Tadahiro
来源:IEEE Journal of Solid-State Circuits, 2014, 49(1): 223-231.
DOI:10.1109/JSSC.2013.2282113

摘要

A noncontact and housing-less thin-thick connecting method was developed for mobile industry processor interface (MIPI) applications. This paper describes the world's first 0.15-mm-thick connector using a vertical directional coupler (VDC) which enables simultaneous two-link communication with one coupler without fatal performance degradation. We have analyzed the conditions for isolating two links in a coupler, and the design method is discussed. A fully balanced pulse transmitter implemented in 90-nm CMOS technology significantly suppressed electromagnetic interference (EMI), which agrees well with MIPI requirements. An experimental liquid crystal display interface system reached a maximum data rate of 2.3 Gb/s/link at a bit error rate of less than 10(-12) and a power consumption of 1.47 pJ/b. The timing margin of single link was 320 ps (=64% U.I.) and of two links was 305 ps (=61% U.I.) at 2.0 Gb/s.

  • 出版日期2014-1