摘要

In the current study, the reduced graphene oxide (rGO) was introduced intoW-Cu composites for in-situ formation ofWCparticles using one-step thermal reduction and followed by spark plasma sintering reaction at 1050 degrees C for 10 min under a pressure of 80 MPa in a vacuum atmosphere. The microstructural characteristics, interface structure and mechanical properties of composite were investigated. The results exhibited that the GO flakes were effectively reduced to graphene in the rGO/W-Cu composites powders after reduction in hydrogen at 350 degrees C for 120 min. The relative density of rGO/W-Cu composites is higher than that of rGO-free composite that is attributed to the formation of some WC phases which can enhance the wettability between W and Cu in the sintering process. The formation of WC interlayer with thickness of about 8 nmat the W/Cu interface suggests thatWand C atoms diffusemutually and accumulate to form the carbides at theW-Cu interfaces in sintered rGO/W-Cu. The formation ofWC at the interface can also enhance the interfacial bonding strength ofWand Cu matrix. No evidence ofW-Cu interfacial separation can be found in fracture surface, demonstrating positive effect of rGO on the interfacial strength of the composite.