摘要
The germanium-distribution profile is investigated in a Si/SiO2/Si structure after the implantation of Ge-74 into SiO2 dielectric layer, bonding with the Si device layer, and high-temperature annealing. The anomalously high transport and accumulation of Ge-74 atoms near the SiO2/Si interface far from the bonded boundary is found. The observed Ge-74 distribution is beyond the framework of the existing model of diffusion of Ge in Si and SiO2 after postimplantation annealing. A modified model of diffusion of Ge atoms near the Si/SiO2 interface qualitatively explaining the observed features is proposed.
- 出版日期2014-5