摘要

We propose a low-cost plasma process technique to fabricate narrower front electrode grooves on a single crystalline silicon solar cell, in which a surface discharge operated at high pressure etches a silicon nitride film 150 nm thick on a silicon layer. Tests showed that the surface discharge could effectively etch the silicon nitride film in a short time; a high etching rate exceeding 3000 nm/min was obtained. Narrow and uniform grooves with a width of less than 70 mu m were obtained when the pressure in the chamber, the back electrode length, and the etching time were 152 kPa, 2 mm, and 10 s, respectively. Narrower electrode grooves could be obtained when the back electrode length was short and the pressure was high.

  • 出版日期2011-4

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