Modeling fluid velocity response for wafer scanning in immersion lithography

作者:Chen, Hui; Fu, Xin; Zou, Jun*; Yang, Huayong; Ruan, Xiaodong; Gong, Guofang
来源:Microelectronic Engineering, 2010, 87(5-8): 1082-1085.
DOI:10.1016/j.mee.2009.11.062

摘要

In order to improve optical lithography resolution, a method has been proposed to insert a high refraction index liquid in the space between the lens and the wafer in place of the low refractive index air that currently fills the gap. During exposure period, the scanning process of wafer is repeated many times on a typical wafer, and the immersion liquid motion is greatly influenced by it. As a nominally scanning time of wafer is short (<0.1 s), the unsteady effect cannot be ignored, which play an important role in the immersion liquid renovation and optical birefringence. Considering the unsteady effect induced by the scanning process of wafer, models have been established to describe the limited flow field between the lens and the wafer.