科研之友
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摘要
A very compact electromagnetic bandgap structure is presented for integrated-circuits applications. This structure, which is one kind of high-impedance surface with periodic interdigital elements, is adopted to increase the fringe capacitor in order to compress the overall size of the high-impedance surface. Its design used the effective-circuit model. The measured results show that a 30% to 40% size reduction can be obtained. This will be very valuable for practical applications.
- 出版日期2004-6-20
- 单位中国人民解放军国防科学技术大学
