A novel compact side-pumped bonded slab microchip laser

作者：Yin, C.^*; Huang, L.; Gong, M.; Yan, P.; Liu, Q.; He, F.

来源：Laser Physics Letters, 2007, 4(8): 584-587.

DOI：10.1002/lapl.200710037

• slab microchip laser
• side-pumped
• heat distribution

Diode end-pumped microchip passively Q-switched Nd:YAG laser is widely used in many application fields. But the most important defect of the structure is that its poor thermal characteristic limits the output power and working reliability. In this paper, a novel compact side-pumped bonded slab microchip laser is put forward to solve the critical thermal problem. We use a commercial laser bar as pump source and a piece of bonded slab YAG as laser crystal to construct the compact microchip laser. Based on this compact structure, we have achieved 4.75 W output power and 43.9 kW peak power with 9 kHz repetition rate and 12 ns pulse width. Comparing with end-pumped structure, heat distribution in this structure is much more uniform. Experimental results indicate that this compact microchip slab laser can achieve high output power with excellent thermal characteristics.

• 出版日期2007-8
• 单位清华大学