摘要

Based on the analytical thermal model for the top layer of three-dimensional integrated circuits (3D ICs) without through silicon vias (TSVs), the corresponding analytical thermal model taking TSVs into account is proposed. TSVs density ρand effective thermal conductivity is introduced in this paper. The simulation results show that, the temperature increases sharply with the decrease of ρfor more layers and smaller ρ, and the best range of TSVs density ρis 0.5% to 1% for an 8-layer 3D IC. These results can be effectively used as design guidelines in 3D IC thermal management studies.

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