Lumped Parameter Modeling for Thermal Characterization of High-Power Modules

作者：Iachello Marco^*; De Luca Viviana; Petrone Giuseppe; Testa Natale; Fortuna Luigi; Cammarata Giuliano; Graziani Salvatore; Frasca Mattia

来源：IEEE Transactions on Components, Packaging and Manufacturing Technology, 2014, 4(10): 1613-1623.

DOI：10.1109/TCPMT.2014.2353695

• Finite element (FE) thermal model
• power module
• RC passive network
• thermal impedances

Power electronic modules are realized by integrating several semiconductor chips inside one package. In this paper, a new thermal modeling procedure and its application to a power electronic module are presented. The adopted modeling strategy consists of the derivation of numerical thermal impedances by 3-D finite element models, validated by comparison with available experimental data, and of the coefficients identification of the RC passive network, through a specific topology, here introduced, to obtain a lumped parameter model of the thermal behavior of the module.

• 出版日期2014-10