科研之友
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摘要
High-power electronic devices with multiple heating elements often require temperature uniformity and operating within their functional temperature range for optimal performance. A multi-channel cooling experiment apparatus is developed for studying heat removal inside an electronic device with multiple heat sources. It mainly consists of a computer-controlled pump, a multi-channel heat sink for multi-zone cooling, and the apparatus for measuring the temperature and pressure drop. The experimental results show the system and the designed multichannel heat sink structure can control temperature distribution of electronic device with multiple heat sources by altering coolant flow rate.
- 出版日期2016
- 单位电子科技大学
