An Analytic Approach for the Temperature and Strain Fields of Composite Laminate Curing on a Solid Mold

作者：Li Jun; Yao Xue Feng^*; Liu Ying Hua; Cen Zhang Zhi; Kou ZheJun; Dai Di

来源：Mechanics of Advanced Materials and Structures, 2011, 18(4): 272-281.

DOI：10.1080/15376494.2010.483329

• curing
• transient heat conduction
• surplus temperature
• strain and curvature fields

According to the curing process of composite laminate, a simplified one-dimensional (1D) transient heat conduction model for the composite laminate is established. Based on a typical curing technological curve, the relationships are studied among the processing conditions including convective heat transfer coefficient, the thickness of the part, Fourier number and surplus temperature etc. Furthermore, the useful engineering charts for the center surplus temperature of the composite laminate in the thickness direction are given. Also based on the simplified 1D model, temperature field for the three-dimensional (3D) laminate structure under the hold stage which lay on top of a conforming mold is determined. Then based on the temperature field, the internal strain and curvature distribution of the curing composite laminate are calculated.

• 出版日期2011
• 单位清华大学; 中国航空工业集团公司北京航空制造工程研究所