An Equation-Based Circuit Model and Its Generation Tool for 3-D IC Power Delivery Networks With an Emphasis on Coupling Effect

作者:Cheng Chi Hsuan*; Cheng Tai Yu; Du Cheng Han; Lu Yi Chang; Chiou Yih Peng; Liu Sally; Wu Tzong Lin
来源:IEEE Transactions on Components, Packaging and Manufacturing Technology, 2014, 4(6): 1062-1070.
DOI:10.1109/TCPMT.2014.2316301

摘要

In this paper, a methodology to characterize the electrical behaviors of power delivery networks (PDNs) in 3-D integrated circuits is presented. An automation tool is developed to effectively construct SPICE compatible equivalent circuit models of target PDNs. The core of the tool consists of three equation-based algorithms, which not only model the planar PDN and through-silicon vias in detail, but also the interactions between them through the silicon surface. Simulation results from the proposed SPICE model are in close agreement with the ones obtained from the full-wave simulator up to 40 GHz with more than 100 times speedup.