科研之友
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摘要
In three-dimensional integrated circuit, the heat distribution of circuit is irregular and unfixed. Superposition of power consumption in each layer is easy to form hot spots, which seriously affect the performance of the chip. In previous studies, this problem is generally solved by insertion of thermal through silicon via or the reasonable location optimization for TSVs. However, the fixed TSV positioning can't alleviate the dynamic change of hot spots. In this paper, a method to relieve the dynamic hot spots in 3D IC by switching signal in TSV dusters is proposed. When signal is switched in TSV clusters, the variation of the thermal distribution of the chip is analyzed in detail. And we select each signal's TSV cluster transmission path in real time according to the thermal distribution. So that the temperature of the chip can be evenly distributed and the chip can be protected from the hot spots' continuous work. In order to realize the timely signal switching, we designed a TSV cluster switching algorithm and a temperature sensor circuit. The result shows that when a hot spot appears in the circuit which temperature is above 47.67 degrees C, the signal in the TSV cluster is switched to enable the hot spot gets effectively alleviate.
- 出版日期2018-4-15
- 单位北京工业大学
