High-Frequency Characterization of Through-Silicon-Vias With Benzocyclobutene Liners

作者：Wu, Ke; Wang, Zheyao^*

来源：IEEE Transactions on Components, Packaging and Manufacturing Technology, 2017, 7(11): 1859-1868.

DOI：10.1109/TCPMT.2017.2751480

• 3-D integration
• polymer
• through-siliconvia (TSV)
• transmission property

This paper presents design, fabrication, and high-frequency characterization of through-silicon-vias (TSVs) with benzocyclobutene (BCB) as the dielectric liner to exploit its low dielectric constant. Fabrication processes for BCB polymer liner TSVs are developed, and BCB-liner TSVs have been successfully fabricated in both low-resistivity silicon and high-resistivity silicon substrates for comparison. A de-embedding method that enables extraction of S-parameters from cascade TSV chains is developed based on the thru-reflect-line calibration algorithm, and the S-parameters of BCB-liner TSVs have been obtained from the measured transmission properties of cascade TSV chains with frequencies up to 25 GHz. Measurement results show that the BCB liner improves transmission properties of TSVs up to 10 GHz compared with SiO2-liner TSVs, and substrate resistivity dominates transmission properties for frequencies higher than 10 GHz.

• 出版日期2017-11
• 单位清华大学