摘要
We proposed a novel SRAM architecture with a high-density cell in low-supply-voltage operation. A self-write-back sense amplifier realizes cell failure rate improvement by more than two orders of magnitude at 0.6 V. A cascaded bit line scheme saves additional process cost for hierarchical bit line layer. A test chip with 256 kb SRAM utilizing 0.495 mu m(2) cell in 65 nm CMOS technology demonstrated 0.7 V single-supply operation.
- 出版日期2009-4