Magnetic Wireless Interlayer Transmission Through Perpendicular MTJ for 3-D IC Applications

作者：Chang Liang Shun^*; Wang Ching Hua; Dai Kun Yu; Shen Kuei Hung; Tsai Ming Jinn; Lin Chrong Jung; King Ya Chin

来源：IEEE Transactions on Electron Devices, 2014, 61(7): 2480-2485.

DOI：10.1109/TED.2014.2324591

• Contactless 3-D IC integration
• magnetic RAM (MRAM)
• magnetic tunneling junction (MTJ)
• Non-Volatile Memory (NVM)

A new wireless 3-D integrated circuit connection method, magnetic-sensing transmission interface (MTI), is reported for the first time. Signal transmission through the MTI implemented by placing a high-sensitivity sensor with perpendicular magnetic anisotropy on the top of a microcoil transmitter is successfully demonstrated. This new contactless magnetic signal transmission method featuring low-power, wideband-width, and multilayer wireless data transmission is a viable candidate for future 3-D circuit integration technology.

• 出版日期2014-7
• 单位中国科学院电工研究所; 清华大学