科研之友
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摘要
A simple and efficient packaging technique with aluminium-core printed circuit board component embedded copper reflectors is presented for fabricating high-power white light emitting diode (LED) arrays. Three-dimensional finite element simulation and dynamic infrared imaging for analysis of the packaged nine-chips LED array are carried out to investigate the thermal and optical properties. The results show the method, which obtained a luminous efficiency of 126 1m/Wand thermal resistance of 3.4 K/W, is suitable for high efficiency and low-cost LED based solid-state lighting.
