Multi-LED package design, fabrication and thermal analysis

作者：Poelma R H^*; Tarashioon S; Van Zeijl H W; Goldbach S; Zijl J L J; Zhang G Q

来源：Chinese Journal of Semiconductors, 2013, 34(5): 054002.

DOI：10.1088/1674-4926/34/5/054002

• Finite element simulations
• High resolution
• Thermal imaging cameras
• Thermal measurements
• Thermal modeling
• Thermal modelling
• Thermal optimization
• Thermal Performance

An ultra-thin multi-LED package is designed, manufactured and its thermal performance is characterized. The objective of this study is to develop an efficient thermal modelling approach for this system which can be used for optimization of the thermal-performance of future ultra-thin designs. A high-resolution thermal imaging camera and thermocouples were used to measure the temperature distribution of the multi-LED package and the LED-die temperature for different operating powers. Finally, we compare the thermal measurements with the finite element simulation results. It is concluded that the modelling approach can assist in the thermal optimization of future multi-LED package designs.

• 出版日期2013