A new solder wetting layer for Pb-free solders

作者：Oh Chang Yul; Roh Hee Ra; Kim Young Min; Lee Jin Soo; Cho Hae Young; Kim Young Ho^*

来源：Journal of Materials Research, 2009, 24(2): 297-300.

DOI：10.1557/JMR.2009.0047

We developed a new Cu-Zn wetting layer for Pb-free solders. By adding Zn to the Cu wetting layer, intermetallic growth in the Sn-Ag-Cu (SAC) solder interfaces was delayed. Cu(3)Sn intermetallic compounds and microvoids were not observed ill the SAC/Cu-Zn interfaces after aging. The drop reliability of the SAC solder/Cu-Zn joints was excellent.

• 出版日期2009-2